• Estimate electromigration median time to failure from a calibrated Black prefactor, current density, current exponent, activation energy, and conductor temperature.
• Compare fabrication or device scenarios while holding coefficients and unit conventions constant.
• Check a hand calculation before moving to a higher-fidelity process, circuit, or TCAD model.

The prefactor A is not simply a time: its dimensions depend on n and on the numerical current-density unit used during calibration. This tool defines J in A/cm², so a prefactor fitted with MA/cm² cannot be reused unchanged.^[1]

• Black's equation is an empirical life model. It does not resolve current crowding, Joule self-heating, Blech-length immunity, stress evolution, geometry changes, or a transition between failure mechanisms; A, n, and Ea must be fitted for a compatible structure and criterion.
• Use parameters measured for the same material, geometry, temperature, and operating regime whenever the result informs engineering work.

• Black Exponent Extraction

  Fit exponent n from two matched electromigration lifetime tests before using that exponent in the Black lifetime model.

• Copper Size Effect

  Estimate how narrow-line scattering raises copper resistivity, which can change current density and electromigration stress for a given geometry.