Use this semiconductor calculation for first-order device, material, fabrication, interconnect, packaging, or reliability estimates when every coefficient and unit convention is known.

Deposited thickness (nm)

Required number in nm. Thickness of the deposited film, defined as final thickness minus initial thickness. Must be at least 0 nm; 0 yields 0 nm/min.

Deposition time (min)

Required number in min. Total CVD process time. Must be greater than 0 min.

The cited overview of Semiconductor device supplies background for the terminology and domain context used by this tool.^[1]

Divide the deposited film thickness (final thickness minus initial thickness) by the process time to get the average CVD deposition rate. Inputs are interpreted exactly in the displayed units and the calculation returns the following fields without presentation rounding.

Deposition rate (nm/min)

Returned number in nm/min. Average CVD deposition rate over the measured interval.

• Material composition, geometry, process history, temperature, electric field, bias, interfaces, parasitics, and fitted parameter ranges can invalidate a compact semiconductor model.
• Deposited thickness must be at least 0.
• Deposition time must be at least 5e-324.
• Use finite inputs in the displayed units, preserve source measurements and assumptions, and independently verify consequential decisions.

Compare the estimate with measured process data, current device documentation, and a higher-fidelity circuit, field, thermal, quantum, or TCAD model when the decision requires it.

• Epitaxy Growth Rate Calculator

  Divide the grown epitaxial layer thickness (final minus initial) by the deposition time to get the average epitaxy growth rate.

• Etch Rate Calculator

  Divide the removed thickness (initial film thickness minus final film thickness) by the etch time to get the average etch rate.

• ALD Growth Per Cycle Calculator

  Divide the total ALD film thickness (final minus initial) by the number of cycles to get the average growth per cycle.