Thermal Via Barrel Resistance
Estimate one-dimensional thermal resistance through the plated via barrel, L/(kA), where A is the annular copper cross-section. Board laminate, pads, and spreading resistance are excluded.
Description
Estimate one-dimensional thermal resistance through the plated via barrel, L/(kA), where A is the annular copper cross-section. Board laminate, pads, and spreading resistance are excluded.
Thermal Via Barrel Resistance: Estimate one-dimensional thermal resistance through the plated via barrel, L/(kA), where A is the annular copper cross-section. Board laminate, pads, and spreading resistance are excluded.
When to use Thermal Via Barrel Resistance
Use this electronics calculation for a first-pass component, converter, signal, motor, or sensor estimate when the stated operating conditions and units match the device data.
- Via length (m)
- Required number input.
- Inner barrel radius (m)
- Required number input.
- Plating thickness (m)
- Required number input.
- Copper thermal conductivity (W/m·K)
- Required number input.
How Thermal Via Barrel Resistance works
Estimate one-dimensional thermal resistance through the plated via barrel, L/(kA), where A is the annular copper cross-section. Board laminate, pads, and spreading resistance are excluded. The tool evaluates the supplied inputs together and returns the named outputs below; it does not infer omitted operating conditions or change the units shown.1
- Thermal Resistance KPer W
- The resulting thermal resistance kper w returned as a number.
Limitations and assumptions
- Compact electronics formulas omit some combination of tolerances, temperature drift, bandwidth, loading, parasitics, noise spectrum, nonlinearity, clipping, calibration, layout, and device-specific limits. Typical datasheet values are not guaranteed limits.
- Use finite inputs in the displayed units and preserve more precision than the final presentation requires. Independently verify safety-critical, financial, compliance, or production decisions.
Alternative or Complementary approaches
Check the result against the current datasheet and worst-case operating corners, then verify the circuit or measurement with simulation and bench testing where failure matters.
References
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Electronics — Wikipedia contributors
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