Use this semiconductor calculation for first-order device, material, fabrication, interconnect, packaging, or reliability estimates when every coefficient and unit convention is known.

Cure temperature (°C)

Required number in °C. Target curing temperature.

Reference time (min)

Required number in min. Cure duration at the reference temperature.

Reference temperature (°C)

Required number in °C. Temperature the reference duration was measured at.

Q10 factor

Optional number. Multiplicative time change for each 10 °C decrease.

The cited overview of Integrated circuit packaging supplies background for the terminology and domain context used by this tool.^[1]

Scale an underfill reference cure time to a target temperature using a documented heuristic that doubles the cure time for every 10 degrees Celsius below the reference. Inputs are interpreted exactly in the displayed units and the calculation returns the following fields without presentation rounding.

Cure time (min)

Returned number in min. Estimated cure duration at the target temperature.

• Material composition, geometry, process history, temperature, electric field, bias, interfaces, parasitics, and fitted parameter ranges can invalidate a compact semiconductor model.
• Cure temperature must be at least -273.15.
• Use finite inputs in the displayed units, preserve source measurements and assumptions, and independently verify consequential decisions.

Compare the estimate with measured process data, current device documentation, and a higher-fidelity circuit, field, thermal, quantum, or TCAD model when the decision requires it.

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