Semiconductor Cu Cu Bonding Resistance Calculator
Extract actual multi-current Kelvin Cu-Cu bond resistance and voltage offset separately; not scalar V/I or contact resistivity geometry, no bond-strength approval.
Description
Four-wire current-voltage records can separate a contact resistance slope from a voltage offset.
Four-wire current-voltage records can separate a contact resistance slope from a voltage offset.1
Keeping the free intercept avoids treating every observed voltage as pure resistive drop.
When to use Semiconductor Cu Cu Bonding Resistance Calculator
Use this tool when you need to calculate the stated measurement summary or conditional model from matched observations. Prepare independently matched device or specimen measurements, units, branch selection, and model or calibration conventions.
How to use Semiconductor Cu Cu Bonding Resistance Calculator and understand its results
- Prepare independently matched device or specimen measurements, units, branch selection, and model or calibration conventions.
- Enter observedCuBondFourWireAmps, observedCuBondFourWireVolts, following the field table and calculation rules below, then run the tool.
- Read fittedCuBondResistanceOhms, fittedVoltageOffsetVolts, bondIvFitRSquared. Use the output table and calculation rules below to interpret units, signs, crossings, and flags.
- Correct any input issues and run again. Before using a successful result, review its units, signs, evidence coverage, and stated model or reference assumptions.
| Input field | Meaning | Value type | Requirement |
|---|---|---|---|
| observedCuBondFourWireAmps | Observed cu bond four wire amps | list of number | Required |
| observedCuBondFourWireVolts | Observed cu bond four wire volts | list of number | Required |
Fit finite aligned currents and voltages with a free intercept and nonzero current variance. Return slope in ohms, intercept in volts, and R². Signed slopes and offsets are preserved.
The regression helper accepts 2–10000 aligned finite pairs with nonzero predictor variance. It fits ordinary least squares with a free intercept using shifted coordinates; samples need not be sorted unless this tool additionally requires it. R² is clamped to [0,1] and is one for constant responses. Transformed fits use the stated log or reciprocal predictor/response basis; R² is a fit summary rather than a confidence interval.
V=a+bI; resistance=b; offset=a Read these symbols with the field meanings and branch or reference rules above.
| Output field | Meaning | Value type |
|---|---|---|
| fittedCuBondResistanceOhms | Fitted cu bond resistance ohms | number |
| fittedVoltageOffsetVolts | Fitted voltage offset volts | number |
| bondIvFitRSquared | Bond iv fit r squared | number |
{
"input": {
"observedCuBondFourWireAmps": [
1,
2,
3
],
"observedCuBondFourWireVolts": [
2,
3,
4
]
},
"output": {
"fittedCuBondResistanceOhms": 1,
"fittedVoltageOffsetVolts": 1,
"bondIvFitRSquared": 1
}
}Limitations and assumptions
Measurements, branch identification, units, and model applicability must be independently established. Results do not supply universal material constants, a complete physical model, or operating-condition approval.
Missing required fields, unknown fields, wrong types, and violated calculation rules return input issues. Numeric values must be finite; nonfinite numeric outputs are rejected. Arrays must be dense, with no missing cells. Numeric lists allow at most 10000 entries, subject to smaller tool-specific bounds above.
Alternative or Complementary methods
For a related task, use Semiconductor Monolithic 3d Inter Tier Via Resistance Calculator: Equal parallel via clusters combine several paths and a separate cluster contact contribution. Removing the contact term and scaling by path count infers a conditional single-via resistance. For a complementary step, use Semiconductor AlGaN Gan Hemt Contact Resistance Calculator: A transmission-line-method trace separates a single-contact resistance contribution from a sheet-resistance slope. Its interpretation depends on matched contact width and independently selected linear measurements.
References
Similar or alternative tools
- Semiconductor Monolithic 3d Inter Tier Via Resistance Calculator
Equal parallel via clusters combine several paths and a separate cluster contact contribution. Removing the contact term and scaling by path count infers a conditional single-via resistance.
- Semiconductor AlGaN Gan Hemt Contact Resistance Calculator
A transmission-line-method trace separates a single-contact resistance contribution from a sheet-resistance slope. Its interpretation depends on matched contact width and independently selected linear measurements.