Poisson Yield Model
Compute chip yield from defect density and die area with the Poisson model.
Description
Compute chip yield from defect density and die area with the Poisson model.
Poisson Yield Model is a focused tool for the following task. Compute chip yield from defect density and die area with the Poisson model. It reports Yield from the values you provide rather than inventing measurements, coefficients, or professional judgment that are not part of the input.
When to use Poisson Yield Model
Use this semiconductor calculation for first-order device, material, fabrication, interconnect, packaging, or reliability estimates when every coefficient and unit convention is known.
- Defect density (defects/cm^2)
- Required number in defects/cm^2.
- Die area (cm^2)
- Required number in cm^2.
The cited overview of Wafer (electronics) supplies background for the terminology and domain context used by this tool.1
How Poisson Yield Model works
Compute chip yield from defect density and die area with the Poisson model. Inputs are interpreted exactly in the displayed units and the calculation returns the following fields without presentation rounding.
- Yield (%)
- Returned number in %.
Limitations and assumptions
- Material composition, geometry, process history, temperature, electric field, bias, interfaces, parasitics, and fitted parameter ranges can invalidate a compact semiconductor model.
- Defect density must be at least 0.
- Use finite inputs in the displayed units, preserve source measurements and assumptions, and independently verify consequential decisions.
Alternative or Complementary approaches
Compare the estimate with measured process data, current device documentation, and a higher-fidelity circuit, field, thermal, quantum, or TCAD model when the decision requires it.
References
-
Wafer (electronics) — Wikipedia contributors
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