Interposer Line Resistance Calculator

Compute the DC resistance of a copper interposer or redistribution line from its length, width, and metal thickness.

Description

Compute the DC resistance of a copper interposer or redistribution line from its length, width, and metal thickness.

Interposer Line Resistance Calculator is a focused tool for the following task. Compute the DC resistance of a copper interposer or redistribution line from its length, width, and metal thickness. It reports Line resistance from the values you provide rather than inventing measurements, coefficients, or professional judgment that are not part of the input.

When to use Interposer Line Resistance

Use this semiconductor calculation for first-order device, material, fabrication, interconnect, packaging, or reliability estimates when every coefficient and unit convention is known.

Line length (µm)
Required number in µm. Routing length of the copper line.
Line width (µm)
Required number in µm. Lithographic width of the copper line.
Metal thickness (µm)
Required number in µm. Copper thickness of the line.

The cited overview of Integrated circuit packaging supplies background for the terminology and domain context used by this tool.1

How Interposer Line Resistance works

Compute the DC resistance of a copper interposer or redistribution line from its length, width, and metal thickness. Inputs are interpreted exactly in the displayed units and the calculation returns the following fields without presentation rounding.

Line resistance (mΩ)
Returned number in mΩ. DC line resistance assuming bulk copper resistivity.

Limitations and assumptions

  • Material composition, geometry, process history, temperature, electric field, bias, interfaces, parasitics, and fitted parameter ranges can invalidate a compact semiconductor model.
  • Line length must be at least 5e-324.
  • Line width must be at least 5e-324.
  • Metal thickness must be at least 5e-324.
  • Use finite inputs in the displayed units, preserve source measurements and assumptions, and independently verify consequential decisions.

Alternative or Complementary approaches

Compare the estimate with measured process data, current device documentation, and a higher-fidelity circuit, field, thermal, quantum, or TCAD model when the decision requires it.

References

  1. Integrated circuit packaging — Wikipedia contributors

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